TY  - BOOK
AU  - Ron M. Kielkowski
TI  - Inside SPICE: Overcoming the Obsacles of Circuit Simulation
SN  - 0-07-113928-1
U1  -  621.3192011353 
PY  - 1994///
CY  - New York,USA
PB  - McGraw-Hill Book Company
ER  -