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Inside SPICE: Overcoming the Obsacles of Circuit Simulation. Ron M. Kielkowski

By: Material type: TextPublication details: New York,USA: McGraw-Hill Book Company, 1994Description: 188 pISBN:
  • 0-07-113928-1
DDC classification:
  • 621.3192011353 KIE-I
Item type: Books
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