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Bioengineering, thermal physiology and comfort

K. Cena

Bioengineering, thermal physiology and comfort K. Cena - New York,USA: Elsevier Scientific Publishing, 1981 - 289 p.

EN

ISBN: 0-444-99761-x

Subjects--Topical Terms:
heat-physiological effect-Congresses

Dewey Class. No.: 612.014462 / BIO-

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